What is the key idea behind wafer level packaging?
Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
What is wafer level assembly?
Abstract: Wafer-Level Packaging (WLP) allows an integrated circuit(IC) to be attached to a printed-circuit board (PCB) face-down, with the chip’s pads connecting to the PCB pads through individual solder balls. This document describes the packaging technique and its advantages.
What is Dsbga?
Die Size Ball Grid Array (DSBGA), also known as Wafer Chip Scale Package (WCSP), refers to packaging an IC in wafer form, in contrast to packaging an IC after it has been singulated from the wafer. It uses a copper redistribution layer to connect the silicon interconnect to an array of solder balls.
What is WLP in semiconductor?
What is Wafer-Level Packaging? Wafer-level packaging (WLP) is the technology of packaging the die while it is still on the wafer—protective layers and electrical connections are added to the substrate before dicing. Originally, wafers were diced into individual chips, then packaged.
Is Wlcsp flip chip?
“Flip Chip” refers to bumps on semiconductor wafers which are in the range of 50 to 200 m in height. “WLCSP” refers to bumps that are in the range of 200 to 500 m in height.
What is DC and RF wafer testing?
Abstract: An automated wafer level RF/DC test system useful to frequency above 20 GHz has been developed to characterize and determine acceptability of microwave semiconductor die prior to dicing the wafer.
What is RDL in semiconductor?
Redistribution layers (RDLs) are the copper metal interconnects that electrically connect one part of the semiconductor package to another. RDLs are measured by line and space, which refer to the width and pitch of a metal trace. Higher-end RDLs may be at 2μm line/space and smaller.
Why ASE for wafer level package?
ASE is with solid experience and superior capability to provide a broad range of Wafer Level Package (WLP) solutions from chip scale packages to SiP to homogeneous and heterogeneous chip integration. ASE is able to provide thinnest profile, lower power consumption and high performance solutions.
What is the difference between awlp and wafer level package?
aWLP has higher I/O than wafer level package. It is a substrate-less solution with small form factor, improved electrical and thermal performance. aWLP is a die down fan out wafer level package with molding compound surrounded, ideally designed for communication devices with constrained space. Support package size up to 10 x 10mm (max.)
What is wire-bonding in WLP?
Before WLP, wire-bonding connected chips to a substrate using wires attached to the edges of the chip. Only so many wires could fit around the chip, limiting its data transfer capacity. The wires were also relatively long, which created a timing lag and wasted power.
What equipment do we offer for Advanced Packaging?
We have a broad suite of equipment for advanced packaging, including ECD, PVD, etch, CVD, and CMP, that enables our customers to implement any packaging scheme, from flip chip to fan-out wafer-level packaging (FOWLP) to through-silicon via (TSV).