How do you reflow a BGA?

How do you reflow a BGA?

What are the steps of BGA repair?

  1. First, remove the components, such as the PCB.
  2. Next, remove the residual solder.
  3. Once you have removed all the excess solder, the BGA can be reballed.
  4. After the excess solder has been removed and the BGA has been reballed, the components and PCB can be re-soldered and reattached.

What temperature does BGA reflow at?

If you must use lead-tin solder paste with lead-free BGA packages, ensure that the reflow temperature is high enough to provide a reliable interconnection. A minimum peak temperature of 220°C is recommended, but a range of 225–245°C (for qualified components) is preferred.

How do I make a BGA reworking machine?

BGA Rework

  1. Step 1: Tools Needed. What you’ll need:
  2. Step 2: Let’s Start. Roughly measure the lenght of your BGA chip.
  3. Step 3: Make a Clip. Using some iron wire, make a clip like the one shown here,
  4. Step 4: Drink That Soda!
  5. Step 5: Flux It.
  6. Step 6: Tin Solder Helps.
  7. Step 7: Gather the Actors.
  8. Step 8: Time to Heat.

How do you hand solder BGA?

BGA Soldering by Hand

  1. Apply Flux Paste (Not Liquid Flux) on to the pad.
  2. Place solder balls very carefully on the pad.
  3. Apply paste flux to the bottom (soldering side) of the BGA package.
  4. Carefully place the BGA Package on the solder balls.
  5. Preheat and then apply Hot Air with Hot Air Blower from both top and bottom.

How do you solder a BGA package?

Do you need paste for BGA?

Yes, you still want to use paste. The reason is, the balls remain firm, like balloons of solder, and may not stick to the surface; whereas the paste is finely divided, and wets and connects to surfaces very effectively. So the paste is able to wet both the pad and the ball, and stick them together.

How to heat a preform in a BGA?

Using angle brackets or other meas “square up” the preform to the BGA. Place “sandwich” construction of the preform and device in to reflow oven or other heat source. Make sure the proper temperature settings are in place.

How do you Reball a BGA?

Simple BGA Reballing. 1 Step 1: Deball the Device. Apply water soluable paste flux using a syringe and smear with a gloved finger on the balls of the device. Using the proper 2 Step 2: Clean the Deballed Part. 3 Step 3: Apply Paste Flux. 4 Step 4: Put Preform Ball Side Up. 5 Step 5: Carefully Place Device on Top of Preform.

How to heat a BGA chip?

when we’ll direct hot air onto the BGA chip. with the help of a little brush, from all sides. it will help us during heating process, as it will indicate when the meltin temperature is reached. Clamp the board to your workbench so it doesn’t move. Make sure the chip stays out of table, so it can be heated from bottom.